LG Chem
Korean maker of petrochemicals, resins, synthetic rubber, battery and electronic materials
Company facts
- Country
- South Korea
- Website
- lgchem.com ↗
- Founded
- 1947
- Business registration
- Not provided
- Main export markets
- Sales companies in China, Germany, the USA and Singapore, and overseas manufacturing in China, Hungary and the USA, as shown on the official site.
About
Products
Basic Petrochemicals & Intermediates
- Ethylene, propylene, butadiene, benzene, BPA, acrylic acid, NPG, alcohols, IPA, plasticizers and caustic soda
| Group | Products |
|---|---|
| Olefins and aromatics | Ethylene, Propylene, BD, BZ |
| Intermediates | BPA, Acrylate, Alcohol, NPG, IPA |
| Other | Plasticizers, Caustic Soda |
Polyolefins, PVC, Styrenics, PC & SAP
- HDPE, LDPE, LLDPE, m-PE, POE, EVA, PP, PVC, ABS, ASA, SAN, PS, EPS, PC and superabsorbent polymer
| Group | Products |
|---|---|
| Ethylene-based | HDPE, LDPE, LLDPE, m-PE, POE, EVA, UNIQABLE (MDOPE, BOPE) |
| Propylene-based | PP |
| Vinyl | PVC |
| Styrene-based | ABS, ASA, SAN, PS, EPS |
| Other | PC, SAP |
Engineering Plastics & Elastomers
- PC-based, PA-based, mPPO and PP-based compounds plus thermoplastic elastomers; reinforced, conductive, flame-retardant and light-diffusing grades
| Brand | Description on site |
|---|---|
| LUPOY | PC-based engineering plastic |
| LUPOX / LUMAX | Reinforced high-functionality plastic |
| LUMID / LUXY | PA-based, heat resistant |
| LUMILOY | mPPO with dimensional stability |
| LUSEP | Heat, chemical and flame resistant |
View all 10 models & specifications →Showing 5 of 10 models
Battery Materials
- Cathode materials, ceramic-coated separators, CNT, anode binder, conductive agent dispersant and flame barrier foam/sheet
Semiconductor, Display & Automotive Materials
- BUF, CCL/PPG, DAF, NCF, PID, back grinding tape, stripper, OLED materials, switchable glazing film and automotive adhesives
| Product | Use |
|---|---|
| BUF (Build-Up Film) | Multilayer semiconductor substrates |
| CCL/PPG | Semiconductor substrate core material |
| DAF (Die Attach Film) | Chip stacking and thinning |
| NCF (Non-Conductive Film) | Advanced packages such as HBM |
| PID | Fine-circuit formation in packages |
View all 7 models & specifications →Showing 5 of 7 models
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